This direction breaks down and explains specific products, measurement tasks, imaging inputs, algorithm routes, proposed outputs, and acceptance methods, which can be used to evaluate samples and system conditions before the establishment of corporate projects.
Industry scope:PCB blank board and electronic assembly.
Involves measuring routes:Point laser triangular displacement, point scanning three-dimensional topography, bilateral/reference surface differential measurement.
PCB assembly board · Point laser triangular displacement
Specify point height difference
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Connector pins · Point scanning 3D topography
Pin height list
Special development:The measurement/control core needs to be supplemented and verified according to the special project approval
View inputs, outputs, gaps and validation methods →Solder ball packaging sample · Point scanning three-dimensional topography
Dome height and effective point ratio
Special development:The measurement/control core needs to be supplemented and verified according to the special project approval
View inputs, outputs, gaps and validation methods →Lead frame · Point scanning 3D topography
Sampling height abnormal points
Special development:The measurement/control core needs to be supplemented and verified according to the special project approval
View inputs, outputs, gaps and validation methods →Wafer handling fixture·Point laser triangular displacement
Support point height difference
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Patch nozzle · Point laser triangular displacement
Z displacement curve and return difference
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Thermal pad assembly · Bilateral/reference surface differential measurement
Reference surface differential thickness
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Chip test seat·Point laser triangular displacement
Travel and maintain drift
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Electronic and semiconductor assembly height: 8 potential application scenarios of laser spot and light point algorithms
Please describe the task object, original picture or video, target indicators, device platform, interface and sample situation.
Phone: 13910119357