Micro-Epsilon Laser Triangulation Principle
Transmitting, receiving imaging and distance measurement after calibration
Verification date: 2026-10-24
View original public information →LSP074 · Electronic and semiconductor assembly height · PCB blank board and electronic assembly
Need to add new core
Point-by-point height measurement of pin top surface
Facing the connector pins, the point scanning three-dimensional topography is used as the observation route, and a pin height list is planned to be output. The page is for project evaluation and does not mean that the development has been completed or has been accepted on site.
Project Judgment Summary
Product/DeviceConnector pins
Measure routeSCAN·Point scanning 3D topography
Ability GradingNeed to add new core
Verification statusThe actual machine/product domain acceptance of this scenario has not been carried out
Scene nature:Similar potential application scenarios for laser spots. The potential application scenario has not yet been developed into a complete product system; the actual machine/product domain acceptance of this scenario has not been carried out. The actual product/product domain acceptance quantity in catalog statistics is 0.
Business tasks and intended output
- target audience
- Connector pins: point scan 3D topography
- pseudo output
- Pin height list
- Applicable conditions
- Requires fine pitch scanning and pin attribution
- priority
- Special development. The measurement/control core needs to be supplemented and verified according to the special project approval
Imaging input and algorithm routing
Imaging and device conditions
Scanning mechanism with encoder, point laser transceiver geometry and synchronized images. Fixed baseline point laser receiving head and calibration Z platform
SCAN·Point scanning 3D topography
Scanning mechanism with encoder, point laser transceiver geometry and synchronized images
- A41Three-dimensional point set orthogonal plane fitting
- A101Adaptive threshold laser spot grayscale centroid
- A103Logarithmic quadratic surface sub-pixel spot center
- A107Laser spot quality and usability diagnostics
- A111laser spot pixel to camera view angle conversion
Existing algorithmic evidence:A101–A112 only complete analytical synthesis spot and controlled geometry verification; see laser_spot_benchmark.json
Current capabilities and capabilities to be supplemented
Need to add new core
Need to add core computing
Light point extraction can only be used as an observation front-end, and core capabilities such as three-dimensional reconstruction, closed-loop control, wavefront or physical quantity inversion need to be developed and verified separately.
Gaps in this scenario:It is necessary to add new point triangulation intersection, scanning coordinate fusion, surface reconstruction and shape and position evaluation; A41 only fits existing three-dimensional points. Requires fine pitch scanning and pin assignment. The surface reflection of the actual machine and the small measuring range determine whether the effective point can be collected.
Route-level gaps:It is necessary to add new point triangulation intersection, scanning coordinate fusion, surface reconstruction and shape and position evaluation; A41 only fits existing three-dimensional points.
"New cores required" only describes the relative development volume and does not constitute a commitment to accuracy, tempo, stability or delivery time.
Verification methods and acceptance prerequisites
Use a known step/contour sample to perform a blind test with a CMM or profiler to verify the missing area and scanning step distance. Gauge block, microscopic height gauge and independent assembly sample comparison
| Acceptance items | Evidence required for project confirmation | Current status |
|---|---|---|
| Inputs and samples | Real device original frames, normal/abnormal samples, exposure and light path conditions, sample grouping and set aside | Not provided, waiting for project input |
| Magnitude and Error | Independent reference value, calibration record, error statistical caliber and mutual confirmation threshold | Not verified |
| Exceptions and boundaries | Anticipated handling of missed detections, false detections, overexposure, occlusion, reflection, out-of-view and communication abnormalities | To be defined |
| System integration | Interface, time synchronization, deployment platform, tempo, log, version and continuous running record | Not integrated |
Evidence sources and citation boundaries
The source supports measurement principles or similar applications; the module combination, device and acceptance method in this scenario are engineering derivation, and product verification has not been completed.
Micro-Epsilon displacement applications
Industrial height, distance and position measurement categories
Verification date: 2026-10-24
View original public information →NIST 3D Imaging Technology Description
Active point triangulation, scanned geometry and error propagation
Verification date: 2026-10-24
View original public information →Source usage scope:The public information is used to support the measurement principle or the existence of similar applications, and does not prove that this scenario has been developed, deployed or accepted by Jishi Technology.
Project consultation
xuzhiyang0928@gmail.com
Define the Development Scope with Samples and Device Requirements
Point-by-point height measurement of pin top surface
Please describe the task object, original picture or video, target indicators, device platform, interface and sample situation.
Phone: 13910119357xuzhiyang0928@gmail.com