This direction breaks down and explains specific products, measurement tasks, imaging inputs, algorithm routes, proposed outputs, and acceptance methods, which can be used to evaluate samples and system conditions before the establishment of corporate projects.
Industry scope:Semiconductor wafers and packaging.
Involves measuring routes:Separate light spot array comparison, two-dimensional command/target surface coordinate calibration, light spot shape and relative distribution, light spot timing and drift.
VCSEL bare chip·separated spot array comparison
Detachable points and defect locations
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →VCSEL package module · Two-dimensional command/target coordinate calibration
Lattice pose and reference residual
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →VCSEL far-field component · Spot shape and relative distribution
Zone width and morphological distribution
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →VCSEL lens array·separated spot array comparison
List of registration offsets and outliers
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Pulse VCSEL module · Spot timing and drift
Trigger rounds and center discretization
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →Near-infrared point projection module·separated light point array comparison
Array center and point spacing changes
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →VCSEL driver test board·Separate light spot array comparison
The drive group corresponds to the visible point
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →VCSEL collimation package · Spot shape and relative distribution
Point spacing, width and merge status
General extensions:Verification needs to be completed according to the listed optical conditions, calibration and samples.
View inputs, outputs, gaps and validation methods →VCSEL and emission array: 8 potential application scenarios of laser spot and light point algorithms
Please describe the task object, original picture or video, target indicators, device platform, interface and sample situation.
Phone: 13910119357