Enterprise Application Area D16

Semiconductor, wafer, optoelectronic device and display infrared vision development services

For "semiconductor, wafer, optoelectronic devices and display" related equipment manufacturers, system integrators and enterprise R&D, it provides infrared data evaluation, algorithm development, equipment/platform integration and test acceptance, covering 8 types of enterprise application scenarios.

Service scope and implementation plan

direction numberD16
Demand scenario8 items
main inputSWIR L1/L5;
Typical routeT12、T03、T04、T10、T18、T11、T05、T01

The project scope is determined based on samples, equipment, working conditions and written indicators; general modules, special models and multi-sensor integration are configured according to the evaluation results.

Application scenarios and development content

IR121

SWIR Imaging of internal cracks and edge defects in silicon wafers

Minimum input and technical route
SWIR L1/L5;T12
target output
Cracks, chipping and transmission anomalies
Implementation
Requires specialized optics
critical acceptance
Minimum crack compared to microscopic/acoustic true value
IR122

Wafer hot spots and local leakage thermal localization

Minimum input and technical route
MWIR/LWIR Macro L2/L3;T03+T04
target output
Hot spots, coordinates and electrical excitation correlation
Implementation
Requires macro radiation calibration
critical acceptance
Compare with electrical measurement/failure analysis, positioning error
IR123

Lock-in thermography locates chip short circuits and leaks

Minimum input and technical route
L5;T10
target output
Phase hot spots and fault locations
Implementation
Requires electrical stimulation tooling
critical acceptance
Versus probe/open true value, POD
IR124

Photoluminescence PL/Electroluminescence EL Uniformity

Minimum input and technical route
NIR/SWIR L1/L5;T18
target output
Luminous intensity, dark areas and uniformity
Implementation
Need special implementation
critical acceptance
Compared with electrical performance/reference sheet, repeatability
IR125

VCSEL/IR LED array lighting and power uniformity

Minimum input and technical route
NIR/SWIR L1;T11
target output
Luminous Points, Disadvantages, Relative Intensities and Arrangements
Implementation
Reusable A43/A44
critical acceptance
Versus power meter/probe station, point level Recall
IR126

OLED/MicroLED driver thermal anomalies and aging hot spots

Minimum input and technical route
LWIR/MWIR L2/L3;T03+T05
target output
Pixel/area thermal anomalies and aging trends
Implementation
Requires high-resolution optics
critical acceptance
Minimum divisible area, correlation with life data
IR127

Active thermal detection of semiconductor package voids and delamination

Minimum input and technical route
L5;T10
target output
Defect candidate, area and depth proxies
Implementation
Need reference sample
critical acceptance
Versus X-ray/CT/SAM, POD
IR128

Optical filters, windows and detector response uniformity

Minimum input and technical route
Blackbody/Light Source L5;T01+T03
target output
Response plots, bad elements and band consistency
Implementation
Instrument calibration required
critical acceptance
Uniform source repeatability, response residuals

Information required before project evaluation

  • Target equipment/object, site conditions, business processes and follow-up actions to be taken
  • Infrared camera, lens, spectral band, installation distance, field of view, resolution and data interface
  • Original samples and collection parameters under normal, abnormal, boundary and interference conditions
  • Reference truth values and annotation specifications for temperatures, parts, states, or events
  • Target platform, network, interface, storage, latency and operating resource constraints
  • False positives, missed negatives, manual review, linkage, failure handling and acceptance thresholds

Implementation and delivery methods

  1. Project input confirmationCheck camera, spectral band, bit depth, SDK, environmental conditions, sample and acceptance true value.
  2. Sample verificationVerify key processing links, applicable conditions and abnormal working conditions, and determine the development scope and acceptance methods.
  3. Algorithm development and integrationImplement data parsing, algorithms, quality gating, interfaces and target platform deployment.
  4. Test acceptance and handoverRetest according to the agreed test set and target platform, and hand over the deliverables, test results and applicable conditions.
  • Requirements and technical solutions, input and output and interface field definitions
  • Algorithm library, model or SDK/API; delivery form is confirmed in the project plan
  • Sample program, parameter configuration, error status and calling instructions
  • Test set version, indicator definition, stratification results and failed sample records
  • Target platform adaptation, resource usage and running delay records
  • Version, dependencies, license, reproduction steps and applicable conditions description

Acceptance design

Each scenario establishes independent test cases according to "key acceptance". When sharing models across scenarios, results are reported separately for each scenario, distance, load, environment, and target size, supplemented by overall statistics.

When high-risk alarms or controls are involved, the algorithm output is used for review or linkage judgment; safety functions, regulatory responsibilities, and automatic disposal require separate design and acceptance.

Frequently Asked Questions for Enterprise Customers

Can I purchase directly based on one of the scenes?

Can be evaluated first as a separate work package. The formal scope should describe the device, data, target objects, environment, interfaces, delivery form, and acceptance thresholds.

Can it be started when there are no abnormal samples?

The data interface, normal baseline, acquisition plan and simulation/controlled test design can be completed first; the abnormal detection rate and fault classification effect can be evaluated after obtaining sufficient abnormal true values.

Can the algorithm directly trigger alarms or equipment actions?

Duration, deduplication, quality gating, manual review, communication failure and safety interlocking need to be designed based on business risks. High-risk actions should be activated after completion of independent safety mechanisms and on-site acceptance.

Project consultation

Define the Development Scope with Samples and Device Requirements

Semiconductor, wafer, optoelectronic device and display infrared vision development services

Please describe the task object, original picture or video, target indicators, device platform, interface and sample situation.

Phone: 13910119357
xuzhiyang0928@gmail.com

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