PCB power-on hot spots and short circuit location
- target output
- Device-level hot spots, locations and temperature rise profiles
- Implementation
- Requires macro calibration
- critical acceptance
- Versus circuit measurement/fault injection, location rate
Enterprise Application Area D15
PCB, electronic assembly and electronic product infrared vision development services
For "PCB, electronic assembly and electronic products" related equipment manufacturers, system integrators and enterprise R&D, it provides infrared data evaluation, algorithm development, equipment/platform integration and test acceptance, covering 8 types of enterprise application scenarios.
Service scope and implementation plan
direction numberD15
Demand scenario8 items
main inputMacro LWIR/MWIR L2/L3;
Typical routeT03、T04、T05、T10、T20
The project scope is determined based on samples, equipment, working conditions and written indicators; general modules, special models and multi-sensor integration are configured according to the evaluation results.
Application scenarios and development content
Thermal design evaluation of power chips, power devices and magnetic components
- target output
- Device Temperature, Thermal Coupling, and Steady State Time
- Implementation
- Partially reusable
- critical acceptance
- Temperature error compared to thermocouple/junction temperature model
Active Thermal Defect Screening for BGA/QFN Packages
- Minimum input and technical route
- L5；T10
- target output
- Void/Delamination Candidates and Comparison Pictures
- Implementation
- Need to add new core
- critical acceptance
- Versus X-ray/ultrasound/section, POD
PCB copper foil open circuit and high resistance connection phase lock-in thermography
- Minimum input and technical route
- L5；T10
- target output
- Current paths, abnormal hot spots and phase diagrams
- Implementation
- Requires electrical stimulation tooling
- critical acceptance
- Compared to resistance/microscopic true value, minimum defect
Charger, adapter and power supply aging thermal monitoring
- target output
- Temperature rise curve, steady state and abnormal batches
- Implementation
- Partially reusable
- critical acceptance
- Load/environment stratification, batch false negative rate
LED, display module and backlight thermal uniformity
- target output
- Temperature uniformity, hot spots and area statistics
- Implementation
- Partially reusable
- critical acceptance
- Linked to lifetime/brightness data, uniformity repeatability
Electrical thermal screening of connectors, solder joints and wire harnesses
- target output
- Contact temperature rise and poor candidates
- Implementation
- Partially reusable
- critical acceptance
- Current consistency condition, fault Recall
Automatic recording of thermal cycle tests for electronic products
- target output
- Temperature fields, cycle phases and abnormal events
- Implementation
- Need to test system integration
- critical acceptance
- Time synchronization, data integrity, reproducibility
Information required before project evaluation
- Target equipment/object, site conditions, business processes and follow-up actions to be taken
- Infrared camera, lens, spectral band, installation distance, field of view, resolution and data interface
- Original samples and collection parameters under normal, abnormal, boundary and interference conditions
- Reference truth values and annotation specifications for temperatures, parts, states, or events
- Target platform, network, interface, storage, latency and operating resource constraints
- False positives, missed negatives, manual review, linkage, failure handling and acceptance thresholds
Implementation and delivery methods
- Project input confirmationCheck camera, spectral band, bit depth, SDK, environmental conditions, sample and acceptance true value.
- Sample verificationVerify key processing links, applicable conditions and abnormal working conditions, and determine the development scope and acceptance methods.
- Algorithm development and integrationImplement data parsing, algorithms, quality gating, interfaces and target platform deployment.
- Test acceptance and handoverRetest according to the agreed test set and target platform, and hand over the deliverables, test results and applicable conditions.
- Requirements and technical solutions, input and output and interface field definitions
- Algorithm library, model or SDK/API; delivery form is confirmed in the project plan
- Sample program, parameter configuration, error status and calling instructions
- Test set version, indicator definition, stratification results and failed sample records
- Target platform adaptation, resource usage and running delay records
- Version, dependencies, license, reproduction steps and applicable conditions description
Acceptance design
Each scenario establishes independent test cases according to "key acceptance". When sharing models across scenarios, results are reported separately for each scenario, distance, load, environment, and target size, supplemented by overall statistics.
When high-risk alarms or controls are involved, the algorithm output is used for review or linkage judgment; safety functions, regulatory responsibilities, and automatic disposal require separate design and acceptance.
Frequently Asked Questions for Enterprise Customers
Can I purchase directly based on one of the scenes?
Can be evaluated first as a separate work package. The formal scope should describe the device, data, target objects, environment, interfaces, delivery form, and acceptance thresholds.
Can it be started when there are no abnormal samples?
The data interface, normal baseline, acquisition plan and simulation/controlled test design can be completed first; the abnormal detection rate and fault classification effect can be evaluated after obtaining sufficient abnormal true values.
Can the algorithm directly trigger alarms or equipment actions?
Duration, deduplication, quality gating, manual review, communication failure and safety interlocking need to be designed based on business risks. High-risk actions should be activated after completion of independent safety mechanisms and on-site acceptance.
Project consultation
xuzhiyang0928@gmail.com
Define the Development Scope with Samples and Device Requirements
PCB, electronic assembly and electronic product infrared vision development services
Please describe the task object, original picture or video, target indicators, device platform, interface and sample situation.
Phone: 13910119357xuzhiyang0928@gmail.com