Wafer, Semiconductor and Advanced-Packaging Vision Solution

Scope and project-specific requirements

Critical decision conditions

Set separate references/confidentiality for surfaces, microtopography and internal imagery, with wafer/package batch strata.

Service packages and implementation

Select relevant service packages by station and define upstream/downstream data and responsibilities. Modules not selected in the contract are not included by default.

• A11 Wafer, Chip, Package and Precision-Component Appearance Inspection
• A04 PCB, SMT, Solder-Joint and Electronics Assembly AOI
• A09 Connector Terminal, Contact-Pin and Lead Inspection
• A46 LED, Lamp Bead and Display-Module Illumination Inspection
• A47 Fiber-Optic End-Face, Connector and Micro-Optical Interface Inspection
• B01 2D Dimensional and Geometric-Tolerance Measurement
• B10 Photometric-Stereo Microtopography and Surface-Normal Measurement
• F29 Industrial X-Ray Weld, Casting and Foreign-Object Inspection
• F30 Industrial CT Internal-Defect and 3D Dimensional Analysis

Inputs for assessment

Provide business flows, station lists, site samples, existing equipment/IT systems, priorities, responsibilities, budget constraints and staged objectives.

Deliverables and interface agreement

Station-level architecture, service work packages, interface/responsibility matrix, sample-validation plan, risk register and subsystem acceptance plan.

Specify input formats, output fields, coordinates/units, error states, versions and invocation methods. Define review and failure handling. The statement of work determines the exact scope of source code, executables, model files or analysis reports.

Acceptance method and measures

Break business goals into stations and service packages, then define subsystem metrics and cross-system integration tests; do not accept an industry solution using a single aggregate accuracy score.

These are measures to agree and test, not achieved-performance claims. Freeze samples, reference truth, thresholds and hardware/software versions before acceptance; report subgroup results and failures, identifying under-sampled conditions as uncovered.

Implementation and procurement stages

1. Define scope

   Agree targets, stations, inputs and responsibilities in a statement of work, separating required and excluded conditions.

2. Sample validation

   Use representative samples to test critical risks, document feasibility/failures and scope the next-stage estimate.

3. Development and integration

   Implement agreed functions and interfaces with configuration/change records; use offline replay before authorized device or site integration.

4. Acceptance and handover

   Retest against individual measures and hand over contracted artifacts with known limits; manage maintenance, expansion and changeovers as subsequent work packages.

Scope limits and licensing

The package list supports scoping, not automatic inclusion of every module. Define equipment procurement, certification, business-system changes and specialist qualifications separately.

Candidate technologies are not license clearance. Check code, model weights, training data and dependency versions separately. Replace, license or exclude components unsuitable for the intended commercial delivery. Customer data is not used for public training by default.

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