Tiny defect size
Small scratches, particles, edge chipping and contamination require suitable optics, resolution and lighting angle.
Industry Vision Solution / JISHIKEJI
Semiconductor and Precision Manufacturing Vision SolutionVision System Development and Delivery
For wafer, chip packaging, pins, precision parts and micro-defect inspection scenarios, the solution covers small-object imaging, defect segmentation, geometric measurement, OCR traceability and inspection data management.
Waferscratch / particle / edge chipping
Packageappearance / code / pin
Precisiondimension / position / profile
Datatrace / recheck / report
Semiconductor and Precision Manufacturing Vision Solution / JIVISION
Industry Issues
Discuss Project →Typical Challenges
The solution is organized around business requirements, system modules, technical route and onsite delivery boundaries.
Yield and false-alarm balance
Micro-defect inspection needs reviewable rules between miss risk and false-alarm cost.
Reflective materials
Metal, ceramic, glass and packaging materials introduce glare, texture and color interference.
Strict data retention
Records should be searchable by batch, station, image, defect category and measurement result.
Solution Modules
Deployable Vision System Modules
Modules cover imaging, algorithms, software, interfaces, data and onsite maintenance so implementation scope can be defined clearly.
01
Small-object imaging
Use high-resolution cameras, telecentric lenses, coaxial lighting, ring lighting or multi-angle lighting.
02
Defect detection and segmentation
Recognize scratch, particle, contamination, edge chipping, gap, dent and surface abnormality.
03
Geometric measurement
Measure pin spacing, package contour, hole position, edge, angle and key dimensions.
04
Character and code recognition
Recognize package text, batch code, QR code and process traceability data.
05
Recheck and manual confirmation
Support suspected-defect review, sample annotation feedback and rule adjustment.
06
Quality data management
Store images, defect positions, measured values, batches and report statistics.
Applications
Applicable Scenarios
The solution maps typical stations, equipment, production lines and business scenarios.
Wafer and substrate inspection
Inspect scratch, particle, edge chipping, contamination and area abnormality.
Chip package inspection
Inspect package appearance, text, pins, orientation and batch code.
Precision-part inspection
Appearance and dimension inspection for small structural, metal and micro components.
Lab and incoming recheck
Sample review, abnormal records, quality reports and data archive.
Imaging test plan
Defect inspection model
Geometric measurement algorithm
OCR traceability module
Review workflow
Quality data report
Before implementation, prepare inspection-object images or videos, qualified and defective samples, cycle-time requirements, installation space, communication interfaces and acceptance criteria. JIVISION will define the technical route, risk boundary and delivery scope based on samples and site conditions.
Implementation Path
From Scenario Review to Onsite Deployment
Each solution is implemented in stages based on inspection objects, onsite environment, hardware constraints and acceptance criteria.
01
Scenario ReviewProcess, targets and onsite environment02
Sample AnalysisImages, videos, good/bad samples and hard cases03
Solution DesignCameras, lighting, algorithms, platform and interfaces04
ValidationSample testing, metric review and risk confirmation05
IntegrationHardware/software debugging and interface connection06
IterationOnsite debugging, acceptance and data feedbackFAQ
Common Questions
These questions focus on scenarios, technical routes and implementation boundaries.
Does semiconductor inspection require dedicated lighting?
Usually yes. Micro defects and reflective surfaces require lighting selected by material, defect orientation and installation space.
How are acceptance metrics defined for micro defects?
Use customer sample sets to define defect categories, minimum detectable size, miss/false-alarm criteria and recheck workflow.
Can defect position and images be saved?
Yes. The system can store original images, defect coordinates, categories, measured values, batches and time.
Contact
Submit Your Semiconductor and Precision Manufacturing Vision Solution Requirement
Please provide the industry scenario, inspection target, speed and accuracy requirements, onsite environment, interface systems and available image or video samples.