Candidate processing workflow
Connector alignment → pin segmentation/rotated boxes → subpixel centerline, spacing and angle → defect rules
JIVISION offers project development and technical assessment for Connector Terminal, Contact-Pin and Lead Inspection. Scope: Missing, bent, recessed or contaminated pins; pitch and coplanarity.
Missing, bent, recessed or contaminated pins; pitch and coplanarity
Test occlusion and depth of field for dense pins; use extra views or depth measurement when 2D images cannot distinguish coplanarity or recessed-pin height.
These are candidate implementation paths. Establish a baseline on real samples, then select or combine methods for imaging, speed and deployment constraints. Model names do not imply measured project results.
Connector alignment → pin segmentation/rotated boxes → subpixel centerline, spacing and angle → defect rules
Provide product variants, defect definitions and reference parts, acceptable and borderline samples, field of view, takt time, cameras/lighting and trigger/reject interfaces.
Inspection algorithm, model recipes, pin coordinates, OK/NG and traceability interfaces
Specify input formats, output fields, coordinates/units, error states, versions and invocation methods. Define review and failure handling. The statement of work determines the exact scope of source code, executables, model files or analysis reports.
Pin-level recall; position/angle error; false calls per part; minimum detectable bend
Separate test data by product, batch and defect class. Report misses, false calls, minimum visible conditions and line cycle time; test physical rejection separately.
These are measures to agree and test, not achieved-performance claims. Freeze samples, reference truth, thresholds and hardware/software versions before acceptance; report subgroup results and failures, identifying under-sampled conditions as uncovered.
Agree targets, stations, inputs and responsibilities in a statement of work, separating required and excluded conditions.
Use representative samples to test critical risks, document feasibility/failures and scope the next-stage estimate.
Implement agreed functions and interfaces with configuration/change records; use offline replay before authorized device or site integration.
Retest against individual measures and hand over contracted artifacts with known limits; manage maintenance, expansion and changeovers as subsequent work packages.
Image decisions cover visible features under agreed conditions; acceptable appearance does not establish material, strength, sealing or electrical conformity.
Candidate technologies are not license clearance. Check code, model weights, training data and dependency versions separately. Replace, license or exclude components unsuitable for the intended commercial delivery. Customer data is not used for public training by default.
Missing, bent, recessed or contaminated pins; pitch and coplanarity. Deliverables: Inspection algorithm, model recipes, pin coordinates, OK/NG and traceability interfaces
Test occlusion and depth of field for dense pins; use extra views or depth measurement when 2D images cannot distinguish coplanarity or recessed-pin height.
Task-specific measures: Pin-level recall; position/angle error; false calls per part; minimum detectable bend. Separate test data by product, batch and defect class. Report misses, false calls, minimum visible conditions and line cycle time; test physical rejection separately.
After reviewing samples for missing, bent, recessed or contaminated pins; pitch and coplanarity, equipment conditions and interfaces, scope validation, development, deployment and acceptance separately. Data coverage, site changes and delivery rights affect the estimate; no fixed performance or schedule is promised before assessment.
Service ID: A09 · Connector Terminal, Contact-Pin and Lead Inspection
Describe available samples, equipment and target measures. Agree confidentiality and permissions before transferring sensitive or personal data through an approved channel.
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