Quality Inspection & Error-Proofing · A04

PCB, SMT, Solder-Joint and Electronics Assembly AOI

JIVISION offers project development and technical assessment for PCB, SMT, Solder-Joint and Electronics Assembly AOI. Scope: Component displacement, omissions, polarity, solder-joint and board-surface anomalies.

Scope and project-specific requirements

Task / output

Component displacement, omissions, polarity, solder-joint and board-surface anomalies

Critical decision conditions

Supply board revisions, component-substitution rules and reference boards; visual AOI does not replace hidden-joint or electrical continuity tests.

Candidate technical approach

These are candidate implementation paths. Establish a baseline on real samples, then select or combine methods for imaging, speed and deployment constraints. Model names do not imply measured project results.

Candidate processing workflow

Gerber/template registration → SSIM/difference → rotated-box detection or detailed segmentation

Inputs for assessment

Provide product variants, defect definitions and reference parts, acceptable and borderline samples, field of view, takt time, cameras/lighting and trigger/reject interfaces.

Deliverables and interface agreement

Board recipes, AOI algorithm, defect coordinates and review interface

Specify input formats, output fields, coordinates/units, error states, versions and invocation methods. Define review and failure handling. The statement of work determines the exact scope of source code, executables, model files or analysis reports.

Acceptance method and measures

Task-specific acceptance measures

Miss rate; false calls per board; smallest solder joint; registration residual

Separate test data by product, batch and defect class. Report misses, false calls, minimum visible conditions and line cycle time; test physical rejection separately.

These are measures to agree and test, not achieved-performance claims. Freeze samples, reference truth, thresholds and hardware/software versions before acceptance; report subgroup results and failures, identifying under-sampled conditions as uncovered.

Implementation and procurement stages

  1. Define scope

    Agree targets, stations, inputs and responsibilities in a statement of work, separating required and excluded conditions.

  2. Sample validation

    Use representative samples to test critical risks, document feasibility/failures and scope the next-stage estimate.

  3. Development and integration

    Implement agreed functions and interfaces with configuration/change records; use offline replay before authorized device or site integration.

  4. Acceptance and handover

    Retest against individual measures and hand over contracted artifacts with known limits; manage maintenance, expansion and changeovers as subsequent work packages.

Scope limits and licensing

Image decisions cover visible features under agreed conditions; acceptable appearance does not establish material, strength, sealing or electrical conformity.

Candidate technologies are not license clearance. Check code, model weights, training data and dependency versions separately. Replace, license or exclude components unsuitable for the intended commercial delivery. Customer data is not used for public training by default.

Project FAQs

What does this service produce?

Component displacement, omissions, polarity, solder-joint and board-surface anomalies. Deliverables: Board recipes, AOI algorithm, defect coordinates and review interface

What needs to be confirmed first?

Supply board revisions, component-substitution rules and reference boards; visual AOI does not replace hidden-joint or electrical continuity tests.

How is acceptance defined beyond a demonstration?

Task-specific measures: Miss rate; false calls per board; smallest solder joint; registration residual. Separate test data by product, batch and defect class. Report misses, false calls, minimum visible conditions and line cycle time; test physical rejection separately.

How are cost and schedule assessed?

After reviewing samples for component displacement, omissions, polarity, solder-joint and board-surface anomalies, equipment conditions and interfaces, scope validation, development, deployment and acceptance separately. Data coverage, site changes and delivery rights affect the estimate; no fixed performance or schedule is promised before assessment.

PROJECT INQUIRY

Discuss this service for your project

Service ID: A04 · PCB, SMT, Solder-Joint and Electronics Assembly AOI

Describe available samples, equipment and target measures. Agree confidentiality and permissions before transferring sensitive or personal data through an approved channel.

+86 13910119357
xuzhiyang0928@gmail.com

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