Examples of PCB and connector visual inspection application solutions

Program overview

PCB and connector visual inspection application solutions are examples of public industry application solutions in the direction of electronic manufacturing vision solutions. For PCB solder joints, connector pins, terminal positions, character screen printing and assembly status inspection, imaging, identification and traceability solutions for electronic manufacturing visual quality inspection are presented. This page is geared towards project evaluation and solution matching. It does not disclose customer names, production line scales, business data or unconfirmed operating indicators. It focuses on what similar computer vision projects need to be evaluated, how to organize the technical route, how to confirm the delivery content, and what information should be prepared for early communication.

Project background

PCB and connector inspection focus on key objects such as solder joints, pins, terminals, sockets, cables and assembly directions. Electronic manufacturing sites usually have many product models, high component density, and obvious reflections and occlusions, which require a combination of rule algorithms, deep learning, and work order recipes. In project communication, it is first necessary to clarify the detection objects, work station locations, sample differences, rhythm requirements, installation space, existing equipment interfaces and acceptance methods. For PCB board inspection, connector assembly, terminal inspection, electronic production line re-inspection and other scenarios, the same visual concept may require different camera angles, light source methods, lens focal lengths, trigger methods and judgment rules at different sites. Therefore, JIVISION usually starts with sample analysis and imaging verification, rather than directly applying a fixed template.

Customer needs and assessment points

Typical requirements for this type of project include defective solder joints, misaligned pins, missing connectors, orientation and polarity. In addition to the identification itself, it is also necessary to evaluate whether the test results need to retain pictures, whether the formula needs to be switched according to product model, whether it needs to be connected with PLC, robot, MES, WMS or host computer system, and whether batch reports need to be generated. The main pain points include: the small size of solder joints, pins and terminals, and ordinary imaging is easily interfered by reflections and shadows; there are many product models, and the detection area, direction and character content need to be switched with the work order; the detection results need to be associated with the batch, work station and equipment status to facilitate quality traceability. These issues need to be confirmed through sample testing and field condition analysis, and are not suitable to be replaced by unverified universal indicators.

Technical solution

The technical solution revolves around PCB detection, pin identification, and assembly error prevention, and is implemented in conjunction with the project delivery process. JIVISION will first evaluate the imaging stability, and then design the algorithm link and system interface. Solutions usually include: designing coaxial light, strip light or multi-angle light source combinations based on solder joints, terminals and silk screen positions; establishing positioning correction, pin missing detection, offset determination, character recognition and assembly consistency inspection processes; configuring recipe management, picture retention, inspection reports and MES/device interfaces. In actual projects, traditional image processing, deep learning detection, OCR recognition, instance segmentation, point cloud processing or rule review processes can be combined according to object characteristics, so that the system can both identify targets and explain the basis for judgment.

System architecture

• high resolution imaging
• Local ROI detection
• Defect classification model
• Recipe management

Implementation process

The implementation process generally includes requirement confirmation, sample collection, imaging experiments, solution verification, algorithm training or rule development, interface definition, on-site deployment, acceptance testing, and operation and maintenance handover. At each stage, sample conditions, parameter versions, judgment rules, and abnormal sample records will be precipitated to facilitate subsequent review. When customers subsequently add product models, defect categories or on-site workstations, they can continue to iterate based on the original data and interfaces.

Delivery content

• Electronic parts detection algorithm
• Light source imaging solution
• Test recipe management
• Quality traceability interface

Acceptance and iteration

The acceptance indicators should be determined based on customer samples, on-site test results and testing standards confirmed by both parties. Common evaluation dimensions include recognition accuracy, risk of missed detection, false alarm handling, processing speed, stability under illumination changes, data traceability and maintenance convenience. The solution example description on the public page is used to illustrate the technical route and delivery method. The final project indicators should be based on the customer's real samples, deployment environment and contract agreements.

Applicable scenarios

This solution example is suitable for PCB board inspection, connector assembly, terminal inspection, electronic production line re-inspection and similar needs. It is also suitable for reference by customers who are evaluating machine vision inspection, computer vision algorithms, edge AI vision, 3D vision measurement, robot vision or visual data training. For projects with uncertain technical routes, sample evaluation, imaging testing, and small-scale solution verification can be conducted first to confirm feasibility before proceeding to system development and on-site deployment.

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